1. Overview: 2. Background: High-brightness white light-emitting diodes (LEDs) are very promising in many new illumination applications. LED light sources offer advantages such as long lifespan, fast response speed, environmental friendliness (mercury-free), and a color temperature (5500K-6000K) closer to natural light than xenon sources (4000K). The increasing use of LEDs in automotive lighting (interior lights,
1. Overview: 2. Background: Heating, ventilation, air-conditioning, and refrigeration (HVAC&R) systems consume a significant portion of residential and commercial building energy. Reducing refrigerant charge to mitigate greenhouse gas emissions is a crucial objective. Traditional heat exchangers (HXs) using round tubes and fins have limitations in performance improvement and require further miniaturization to meet reduced refrigerant
1. Overview: 2. Research Background: High-power LEDs are increasingly popular in various applications, offering advantages like long lifespan, high reliability, low energy consumption, fast response time, and color variability. However, their efficiency (15-25% power-to-light conversion) is limited, with over 80% of power dissipated as heat, leading to high junction temperatures. Maintaining junction temperatures below 120°C
Open Access by Dirk Lehmhus Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Wiener Straße 12, 28359 Bremen, GermanyMetals 2024, 14(3), 334; https://doi.org/10.3390/met14030334Submission received: 25 February 2024 / Accepted: 8 March 2024 / Published: 14 March 2024(This article belongs to the Special Issue Advances in Metal Casting Technology) 1. Introduction The present text is the second part of an editorial written for a
Imran Zahid ab, M. Farhan a, M. Farooq a, M. Asim a, M. Imran c Abstract Electronic devices are being used extensively for different applications, where the thermal management of these devices is still a critical challenge due to rapid miniaturization, high heat flux and constantly rising temperature. Phase change materials (PCMs) based thermal management is adopted, but the low thermal conductivity limits their use in temperature-controlled electronic devices. Nano-enhanced phase change materials
Influence of HPDC Process Parameters on the Microstructure of EC Electromotor Housing Marek Brůna 1, Martin Medňanský 1,*, Marek Matejka 1 and Radka Podprocká 2 1Department of Technological Engineering, Faculty of Mechanical Engineering, University of Žilina, Univerzitná 8215/1, 010 26 Žilina, Slovakia 2Rosenberg-Slovakia s.r.o., Kováčska 38, 044 25 Medzev, Slovakia *Author to whom correspondence should be addressed. Metals 2023, 13(2), 295; https://doi.org/10.3390/met13020295 Received:
OksanaOzhoga-MaslovskajaElisabettaGariboldiJannis NicolasLemkeShow moreAdd to MendeleyShareCite https://doi.org/10.1016/j.matdes.2015.12.003Get rights and content Highlights • Critical conditions for blister formation of Al–9Si–3Cu–Fe alloy are identified via a FE model.• Blister formation is modeled for wide range of temperatures, pore pressure, shape, location, and size.• Strain field shows blister formation related to strain localization, depending of pore geometry.• Lamina-shaped discontinuities
Sitao Chen1 and Feng Zhou1 Published under licence by IOP Publishing LtdJournal of Physics: Conference Series, Volume 2044, The 2nd International Conference on Advanced Materials and Intelligent Manufacturing (ICAMIM 2021) 20-22 August 2021, Nanning, ChinaCitation Sitao Chen and Feng Zhou 2021 J. Phys.: Conf. Ser. 2044 012144 Abstract According to the structural characteristics of the radiator, two different gate structures were designed. The