Tag Archives: cooling solutions

Fig. 2 (a) A typical injection moulding cycle [12], (b) temperature variation in one cycle time [13], (c) factors that have influence in the moulded product quality (surface appearance and dimensional accuracy) [12].

Recent Advancement in Conformal cooling channels: A review on Design, simulation, and future trends

Slash Cycle Times and Boost Part Quality: A Deep Dive into Conformal Cooling Channel Technology This technical brief is based on the academic paper “Recent Advancement in Conformal cooling channels: A review on Design, simulation, and future trends” by Soroush Masoudi, Barun K. Das, Muhammad Aamir, and Majid Tolouei-Rad, a preprint available on SSRN (2024).

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Figure 1: Diagram of changing the cooling module material.

A New Hybrid Approach to Cooling High-Power Electronics with HPDC

This technical brief is based on the academic paper “Optimizing the Structural Design of Computing Units in Autonomous Driving Systems and Electric Vehicles to Enhance Overall Performance Stability” by Zhong, Yao-Nian, published in International Journal of Advance in Applied Science Research (2024). It is summarized and analyzed for HPDC professionals by the experts at CASTMAN.

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Fig. 3 The LED headlamp cooling system

The Summarize of High Power LED Headlamps Cooling Design ofAutomobile

This introduction paper is based on the paper “The Summarize of High Power LED Headlamps Cooling Design of Automobile” published by “Applied Mechanics and Materials”. 1. Overview: 2. Abstract: With the luminous flux of high-power white LED has been further improved, LED will gradually replace incandescent lamp and halogen lamp, and become the “fourth generation

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Figure 7. Cross Section Temperature Profiles in Natural Convection for assembly in Figure 2. (a) Top view and (b) Side view. Temperature range shown is 60 to 100°C.

Thermal Management of Bright LEDs for Automotive Applications

This introduction paper is based on the paper “Thermal Management of Bright LEDs for Automotive Applications” published by “7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006”. 1. Overview: 2. Abstract: High brightness white light emitting diodes (LEDs) have shown to be very promising for many illumination

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Figure 1 A typical structure of CPU package and heat sink module.

Challenges in Cooling Design of CPU Packages for High-Performance Servers

This introduction paper is based on the paper “Challenges in Cooling Design of CPU Packages for High-Performance Servers” published by “Heat Transfer Engineering”. 1. Overview: 2. Abstract: Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed

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Figure 9: Top: air-cooled example. Bottom: liquidcooled example.

Thermal Challenges of Wide Band Gap Power Electronics Component in Electrical Vehicle

This introductory paper is the research content of the paper “Thermal challenges of Wide Band Gap power electronics component in electrical vehicle” published by ResearchGate. 1. Overview: 2. Abstract The cooling of power electronics is a fundamental for the best compromise between efficiency, compactness and cost. For the next generation of High Voltage boxes we

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Figure 4-7. Cooling system of the 3D printed sliders

INNOVATIVE COOLING SOLUTIONS OF HPDC TECHNOLOGY

This introductory paper is the research content of the paper [“INNOVATIVE COOLING SOLUTIONS OF HPDC TECHNOLOGY”] published by [Multidiszciplináris Tudományok]. 1. Overview: 2. Abstract In High Pressure Die Casting (HPDC), the so-called sliders are moving components of the mould, that can form cavities, holes, and undercuts. Sliders differ greatly from fixed- and moving mould halves

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Figure 3. Radio filter produced by means of the RSF/RheoMetalTM process. A unique feature of this product is the weight reduction of 1.6 kg facilitated by wall thicknesses as low as 0.4 mm at 40 mm height (aspect ratio 100). High conductivity low Si alloys were used, and thermal transport properties further increased by up to 20% depending on the alloy composition by means of heat treatments, as depicted in the top right diagram by means of arrows denoting the course of the latter (images provided by Comptech AB, Skillingaryd, Sweden).

Advances in Metal Casting Technology: A Review of State of the Art, Challenges and Trends—Part II: Technologies New and Revived

This article introduces the paper ‘Advances in Metal Casting Technology: A Review of State of the Art, Challenges and Trends—Part II: Technologies New and Revived’ published by MDPI. 1. Overview: 2. Abstracts or Introduction The present text, as the second part of an editorial for the Special Issue “Advances in Metal Casting Technology,” builds upon

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Figure 2 Effective stress contours vs. Time

Development of Copper MIM Powders for Thermal Management Applications

This article introduces the paper ‘Development of Copper MIM Powders for Thermal Management Applications’ published by ‘Not explicitly stated in the paper’. 1. Overview: 2. Abstracts or Introduction Abstract Metal Injection Moulding is continuing to see strong growth in the variety and volume of parts andmaterials in use. We report here the development and application

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Design of an LED Thermal System for Automotive Systems

Design of an LED Thermal System for Automotive Systems

This article introduces the paper [‘Design of an LED Thermal System for Automotive Systems’] published by [‘2009 3rd International Conference on Power Electronics Systems and Applications’]. 1. Overview: 2. Abstracts or Introduction This paper investigates high power Light Emitted Diodes (LEDs) with a focus on heat distribution within the heat sink and the correlation between

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