Tag Archives: super computer

Figure 1 A typical structure of CPU package and heat sink module.

Challenges in Cooling Design of CPU Packages for High-Performance Servers

Abstract Jie WeiCorporate Product Technology Unit, Fujitsu Limited , Kawasaki , Japan Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed from a viewpoint of industrial application. Particular attention is directed to heat conduction in the

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