This introduction paper is based on the paper “Challenges in Cooling Design of CPU Packages for High-Performance Servers” published by “Heat Transfer Engineering”. 1. Overview: 2. Abstract: Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed
This introductory paper is the research content of the paper “Thermal challenges of Wide Band Gap power electronics component in electrical vehicle” published by ResearchGate. 1. Overview: 2. Abstract The cooling of power electronics is a fundamental for the best compromise between efficiency, compactness and cost. For the next generation of High Voltage boxes we
This introductory paper is the research content of the paper [“INNOVATIVE COOLING SOLUTIONS OF HPDC TECHNOLOGY”] published by [Multidiszciplináris Tudományok]. 1. Overview: 2. Abstract In High Pressure Die Casting (HPDC), the so-called sliders are moving components of the mould, that can form cavities, holes, and undercuts. Sliders differ greatly from fixed- and moving mould halves
This article introduces the paper ‘Advances in Metal Casting Technology: A Review of State of the Art, Challenges and Trends—Part II: Technologies New and Revived’ published by MDPI. 1. Overview: 2. Abstracts or Introduction The present text, as the second part of an editorial for the Special Issue “Advances in Metal Casting Technology,” builds upon
This article introduces the paper ‘Development of Copper MIM Powders for Thermal Management Applications’ published by ‘Not explicitly stated in the paper’. 1. Overview: 2. Abstracts or Introduction Abstract Metal Injection Moulding is continuing to see strong growth in the variety and volume of parts andmaterials in use. We report here the development and application
This article introduces the paper [‘Design of an LED Thermal System for Automotive Systems’] published by [‘2009 3rd International Conference on Power Electronics Systems and Applications’]. 1. Overview: 2. Abstracts or Introduction This paper investigates high power Light Emitted Diodes (LEDs) with a focus on heat distribution within the heat sink and the correlation between
This article introduces the paper [‘Cooling of Power Switching Device’] published by [‘Jurusan Teknik Elektro, Fakultas Teknik, Universitas Diponegoro’]. 1. Overview: 2. Abstracts or Introduction Abstrak: Dalam hal penggunaan mesin listrik, tentunya kebutuhan akan komponen elektronika daya sangatlah esensial. Komponen elektronika daya bertindak sebagai switching device yang berfungsi dalam pengaturan kinerja mesin listrik yang digunakan.
This article introduces the paper ‘A review of heat pipe application including new opportunities’ published by ‘Frontiers in Heat Pipes’. 1. Overview: 2. Abstracts or Introduction This paper provides a detailed review of heat pipe applications, spanning from computer electronics to renewable energy systems. In the realm of computer electronics, the escalating performance and power
This article introduces the paper [‘Advances in Metal Casting Technology: A Review of State of the Art, Challenges and Trends—Part I: Changing Markets, Changing Products’] presented at the [‘Metals’] 1. Overview: 2. Research Background: Background of the Research Topic: Metal casting is identified as one of the “oldest primary shaping processes known to humanity”. The
This article introduces the paper “An Experimental and Computational Study on the Thermal Performance of Phase Change Material Heatsink Assemblies” presented at the ASME and Applied Thermal Engineering 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8.
