This paper summary is based on the article An Experimental and Computational Study on the Thermal Performance of Phase Change Material Heatsink Assemblies presented at the ASME and Applied Thermal Engineering 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future
This paper summary is based on the article Advanced Thermal Management for High-Power ICs: Optimizing Heatsink and Airflow Design presented at the Applied Sciences (MDPI) 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright:
1. Overview: 2. Research Background: 3. Research Objectives and Research Questions: 4. Research Methodology: 5. Key Research Findings: 6. Conclusion and Discussion: 8. References: [1] US Department of Energy, Energy Efficiency of LEDs, PNNL-SA-94206, March 2013, Available: http://energy.gov/eere/ssl/downloads/energy-efficiency-leds.[2] OSRAM GmBH, Viewed: 27 March 2016, Available: http://www.osram-os.com/osram_os/en/index.jsp.[3] R. Singh, M. Mochizuki, Y. Saito, T. Yamada, T.
1. Overview: 2. Background: High-brightness white light-emitting diodes (LEDs) are very promising in many new illumination applications. LED light sources offer advantages such as long lifespan, fast response speed, environmental friendliness (mercury-free), and a color temperature (5500K-6000K) closer to natural light than xenon sources (4000K). The increasing use of LEDs in automotive lighting (interior lights,
Here is a list of products that are effective when manufactured using Cu (Copper) High Pressure Die Casting (HPDC). The effectiveness in terms of cost and performance can vary depending on complex interactions of factors beyond the manufacturing method, including material properties, design, application requirements, and cost considerations. However, these are the types of components
Open Access by Dirk Lehmhus Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Wiener Straße 12, 28359 Bremen, GermanyMetals 2024, 14(3), 334; https://doi.org/10.3390/met14030334Submission received: 25 February 2024 / Accepted: 8 March 2024 / Published: 14 March 2024(This article belongs to the Special Issue Advances in Metal Casting Technology) 1. Introduction The present text is the second part of an editorial written for a
Abstract Jie WeiCorporate Product Technology Unit, Fujitsu Limited , Kawasaki , Japan Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed from a viewpoint of industrial application. Particular attention is directed to heat conduction in the
