Tag Archives: Heat Sink

Fig. 5. Double silica cooling structure with copper meshes (Ref. [186]).

A Review of Air-Cooling Battery Thermal Management Systems for Electric and Hybrid Electric Vehicles

This article introduces the paper “A review of air-cooling battery thermal management systems for electric and hybrid electric vehicles”. 1. Overview: 2. Background: The paper begins by highlighting the increasing concentration of greenhouse gases (GHGs) since the 1900s, primarily due to the combustion of fossil fuels in internal combustion engines (ICEs). Transportation is a significant

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Fig. 5. Schematic of cooling system assembled with different number of heat pipes:(a) is 2 heat pipes, (b) is 3 heat pipes, (c) is 4 heat pipes, and (d) is 6 heat pipes.

A novel automated heat-pipe cooling device for high-power LEDs

This article introduces the paper “A novel automated heat-pipe cooling device for high-power LEDs”. 1. Overview: 2. Research Background: High-power LEDs are increasingly popular in various applications, offering advantages like long lifespan, high reliability, low energy consumption, fast response time, and color variability. However, their efficiency (15-25% power-to-light conversion) is limited, with over 80% of

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Figure 1. Structure of the AlSi10MnMg alloy cast into a sand mould (GSC): (A)—as-cast condition (HV 10 kV, BSE); (B)—as-cast condition (HV 10 kV, SE); (C)–condition after HT400 (HV 10 kV, BSE); and (D)—condition after HT400 (HV 10 kV, SE).

Thermal Conductivity of AlSi10MnMg Alloy in Relation to Casting Technology and Heat

This article introduces the paper [‘Thermal Conductivity of AlSi10MnMg Alloy in Relation to Casting Technology and Heat Treatment Method’] presented at the [‘MDPI Materials’] 1. Overview: 2. Research Background: Background of the Research Topic: In contemporary industrial applications, particularly with the burgeoning field of electromobility, there is an escalating demand for cast components that exhibit

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Figure 1: Geometrical configuration of the U-shaped cooling channel case.

Thermofluid topology optimization for cooling channel design

This article introduces the paper [‘Thermofluid topology optimization for cooling channel design’] presented at the [‘arXiv.org’] 1. Overview: 2. Research Background: Background of the Research Topic: Cooling channels are critical components in technological systems involving heat extraction, notably in die casting molds. The integration of cooling channels in molds significantly impacts cycle time, part shape

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Figure 5. Six LED Arrayconfiguration and temperature profile.

Thermal study on novel spokes fin for high power LED

This article introduces the paper “Thermal study on novel spokes fin for high power LED” presented at the Engineering Research Express 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright: This material was summarized

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Fig. 1. Structure and dimension of (a) microchannel heat sink and (b) micro-pin-fin heat sink

Comparison of Micro-Pin-Fin and Microchannel Heat Sinks Considering Thermal-Hydraulic Performance and Manufacturability

This article introduces the paper “Comparison of Micro-Pin-Fin and Microchannel Heat Sinks Considering Thermal-Hydraulic Performance and Manufacturability” presented at the IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGY 1. Overview: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 2. Research Background: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References:

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Figure 3 A 3D schematic of the computational domain

An Experimental and Computational Study on the Thermal Performance of Phase Change

This article introduces the paper “An Experimental and Computational Study on the Thermal Performance of Phase Change Material Heatsink Assemblies” presented at the ASME and Applied Thermal Engineering 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8.

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Advanced Thermal Management for High-Power ICs-Optimizing Heatsink and Airflow Design

Advanced Thermal Management for High-Power ICs: Optimizing Heatsink and Airflow Design

This article introduces the paper “Advanced Thermal Management for High-Power ICs: Optimizing Heatsink and Airflow Design” presented at the Applied Sciences (MDPI) 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright: This material was

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Fig. 4. Rounded corners and reinforcement ribs on the lower part (left) and the upper part (right).

RESEARCH ON THE DESIGN FOR PROTECTING THE ARDUINO-MEGA MICROCONTROLLER USED AT AQUATIC EXPLORATION

This article introduces the paper “RESEARCH ON THE DESIGN FOR PROTECTING THE ARDUINO-MEGA MICROCONTROLLER USED AT AQUATIC EXPLORATION” presented at the ACTA TECHNICA NAPOCENSIS 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright: This

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Fig. 1. Fog lights attached to the vehicle

Thermal Flow Analysis for Development of LED Fog Lamp for Vehicle

This article introduces the paper “Thermal Flow Analysis for Development of LED Fog Lamp for Vehicle”. 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright: This material was summarized based on the above paper,

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