Rong-Yuan JouNational Formosa University, Huwei, Yunlin, TaiwanPaper No: ESDA2014-20373, V001T06A004; 9 pageshttps://doi.org/10.1115/ESDA2014-20373Published Online: October 23, 2014 In this study, the mold filling analyses of a thin-walled LED heat sink combined with the vacuum valve runner are simulated by FLOW-3D software. Two topics are analyzed and discussed. First, numerical simulations for variety of molding conditions, including effects of
Open Access by Dirk Lehmhus Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, Wiener Straße 12, 28359 Bremen, GermanyMetals 2024, 14(3), 334; https://doi.org/10.3390/met14030334Submission received: 25 February 2024 / Accepted: 8 March 2024 / Published: 14 March 2024(This article belongs to the Special Issue Advances in Metal Casting Technology) 1. Introduction The present text is the second part of an editorial written for a
Duoc T Phan, Syed H Masood*, Syed H Riza, and Harsh ModiDepartment of Mechanical and Product Design Engineering, Swinburne University of Technology, Hawthorn, Melbourne, Australia*Email: smasood@swin.edu.au Abstract In High Pressure Die Casting (HDPC) process, chill vents are used to allow residual air and gases to exhaust out from the mould cavity. The objective of this
by Byung-Lip Ahn 1,2,Ji-Woo Park 1,Seunghwan Yoo 1,Jonghun Kim 1,Seung-Bok Leigh 2 andCheol-Yong Jang 1,* Abstract Light-emitting diode (LED) lighting should be considered for lighting efficiency enhancement, however, waste heat from light-emitting diode (LED) lighting increases the internal cooling load during the summer season. In order to solve this problem we propose a thermal management system for light-emitting diode (LED) lighting with a
Imran Zahid ab, M. Farhan a, M. Farooq a, M. Asim a, M. Imran c Abstract Electronic devices are being used extensively for different applications, where the thermal management of these devices is still a critical challenge due to rapid miniaturization, high heat flux and constantly rising temperature. Phase change materials (PCMs) based thermal management is adopted, but the low thermal conductivity limits their use in temperature-controlled electronic devices. Nano-enhanced phase change materials
Andrea Sce1 and Lorenzo Caporale1 Published under licence by IOP Publishing LtdJournal of Physics: Conference Series, Volume 525, Eurotherm Seminar 102: Thermal Management of Electronic Systems 18–20 June 2014, Limerick, Ireland Citation Andrea Sce and Lorenzo Caporale 2014 J. Phys.: Conf. Ser. 525 012020DOI 10.1088/1742-6596/525/1/012020 Abstract Finding a good solution for thermal management problems is every day more complex. due to the power density
Sitao Chen1 and Feng Zhou1 Published under licence by IOP Publishing LtdJournal of Physics: Conference Series, Volume 2044, The 2nd International Conference on Advanced Materials and Intelligent Manufacturing (ICAMIM 2021) 20-22 August 2021, Nanning, ChinaCitation Sitao Chen and Feng Zhou 2021 J. Phys.: Conf. Ser. 2044 012144 Abstract According to the structural characteristics of the radiator, two different gate structures were designed. The
Dr. C. Ramesh, A. Subbiah, K. Sivakumar, T. Sri Gokul Abstract This project is about a comparative study of different types of fins and with different types of materials. The main aim of this research is to optimize the cooling rate of the fin in electric motors. Since now a day’s the fossil fuels are
Abstract Jie WeiCorporate Product Technology Unit, Fujitsu Limited , Kawasaki , Japan Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed from a viewpoint of industrial application. Particular attention is directed to heat conduction in the
