High-Pressure Aluminum Die Casting and Copper Die Casting Heatsinks CASTMAN’s high-pressure die casting is a manufacturing process that injects liquid metal into a mold under high pressure. This method offers advantages such as high production speed and the ability to create complex shapes. Aluminum is a lightweight material with high thermal conductivity, making it suitable
CASTMAN has been introducing outstanding die-casting products through leading activities in the die-casting industry, and continuously contributing to the manufacturing industry. High pressure die casting is often an excellent process for quickly manufacturing many parts and has a high level of engineering skills. With CASTMAN’s high pressure die casting, you can quickly produce complex shaped parts using highly
Aluminum high-pressure die casting is a widely used manufacturing process known for its high efficiency and precision. However, producing parts with undercut shapes—features that interfere with the mold opening direction—poses significant challenges. Traditional solutions, such as slide cores or multi-part molds, increase complexity, costs, and limit design flexibility. Application of Salt Core Technology for Undercut
List of Semiconductor Manufacturing Equipment Parts This list provides potential components for semiconductor manufacturing equipment that could be, or are, produced using high-pressure aluminum die casting. The following list is based on general knowledge of die casting applications and semiconductor equipment design. List of Semiconductor Manufacturing Equipment Parts Potentially Made via High-Pressure Aluminum Die Casting:
Here is a list of products that are effective when manufactured using Cu (Copper) High Pressure Die Casting (HPDC). The effectiveness in terms of cost and performance can vary depending on complex interactions of factors beyond the manufacturing method, including material properties, design, application requirements, and cost considerations. However, these are the types of components
Rong-Yuan JouNational Formosa University, Huwei, Yunlin, TaiwanPaper No: ESDA2014-20373, V001T06A004; 9 pageshttps://doi.org/10.1115/ESDA2014-20373Published Online: October 23, 2014 In this study, the mold filling analyses of a thin-walled LED heat sink combined with the vacuum valve runner are simulated by FLOW-3D software. Two topics are analyzed and discussed. First, numerical simulations for variety of molding conditions, including effects of
Duoc T Phan, Syed H Masood*, Syed H Riza, and Harsh ModiDepartment of Mechanical and Product Design Engineering, Swinburne University of Technology, Hawthorn, Melbourne, Australia*Email: smasood@swin.edu.au Abstract In High Pressure Die Casting (HDPC) process, chill vents are used to allow residual air and gases to exhaust out from the mould cavity. The objective of this
by Byung-Lip Ahn 1,2,Ji-Woo Park 1,Seunghwan Yoo 1,Jonghun Kim 1,Seung-Bok Leigh 2 andCheol-Yong Jang 1,* Abstract Light-emitting diode (LED) lighting should be considered for lighting efficiency enhancement, however, waste heat from light-emitting diode (LED) lighting increases the internal cooling load during the summer season. In order to solve this problem we propose a thermal management system for light-emitting diode (LED) lighting with a
Imran Zahid ab, M. Farhan a, M. Farooq a, M. Asim a, M. Imran c Abstract Electronic devices are being used extensively for different applications, where the thermal management of these devices is still a critical challenge due to rapid miniaturization, high heat flux and constantly rising temperature. Phase change materials (PCMs) based thermal management is adopted, but the low thermal conductivity limits their use in temperature-controlled electronic devices. Nano-enhanced phase change materials
Andrea Sce1 and Lorenzo Caporale1 Published under licence by IOP Publishing LtdJournal of Physics: Conference Series, Volume 525, Eurotherm Seminar 102: Thermal Management of Electronic Systems 18–20 June 2014, Limerick, Ireland Citation Andrea Sce and Lorenzo Caporale 2014 J. Phys.: Conf. Ser. 525 012020DOI 10.1088/1742-6596/525/1/012020 Abstract Finding a good solution for thermal management problems is every day more complex. due to the power density
