Category Archives: heat sink-E

Figure 1. Schematic diagram of a typical HPDC process.

Development_of_High_Performance_Copper_Alloy_Chill_Vent_for_High_Pressure_Die_Casting

Boost Cooling Efficiency by 158%: The Power of Copper Alloy Chill Vents in HPDC This technical summary is based on the academic paper “Development of High Performance Copper Alloy Chill Vent for High Pressure Die Casting” published by Duoc T Phan, Syed H Masood, Syed H Riza, and Harsh Modi in International Journal of Mechanical

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Fig. 1: Stir casting process

Review on nano particle reinforced aluminum metal matrix composites

A Deep Dive into the Manufacturing, Strengthening, and Application of Advanced Aluminum Composites This technical brief is based on the academic paper “Review on Nano Particle Reinforced Aluminum Metal Matrix Composites” by Endalkachew Mosisa, V. Yu Bazhin, and Sergey Savchenkov, published in the Research Journal of Applied Sciences (2016). It is summarized and analyzed for

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Figure 1.3 Remote Heat Exchanger for cooling laptop microprocessors.

Beyond Heat Sinks: A Deep Dive into Advanced Loop Cooling for High-Powered Electronics

This technical summary is based on the academic paper “Thermal Control of High-Powered Desktop and Laptop Microprocessors Using Two-Phase and Single-Phase Loop Cooling Systems” published by Randeep Singh in RMIT University (March 2006). It was analyzed and summarized for HPDC experts by CASTMAN experts with the help of LLM AI such as Gemini, ChatGPT, and

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Figure 2.19 Point to point wiring of the active antenna. The two yellow series connected silver mica capacitors are in the foreground

A High Performance Active Antenna for the High Frequency Band

This introduction paper is based on the paper “A High Performance Active Antenna for the High Frequency Band” published by “Defence Science and Technology Group”. 1. Overview: 2. Abstract: The paper presents the design of an active antenna operating from low to high frequency (LF to HF), identifying the main sources of inter-modulation distortion and

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Figure 3 Thermal chain

3W SFP Interface Development

This introduction paper is based on the paper “3W SFP Interface Development” published by Metropolia University of Applied Sciences. 1. Overview: 2. Abstract: The rapid increase in data transfer demands efficient cooling for Small Form-Factor Pluggable (SFP) transceivers, which generate significant heat due to higher energy consumption. This thesis, conducted from February 1 to June

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Fig. 1. Schematic view of the proposed heat sink with concave fins.

New Optimal Heat Sink Design with Concave Fins for Cooling System in Light Emitting Diode Lamp

This introduction paper is based on the paper “New Optimal Heat Sink Design with Concave Fins for Cooling System in Light Emitting Diode Lamp” published by “Electrica”. 1. Overview: 2. Abstract: The heat sink is considered one of the most critical issues in designing and operating light-emitting diode (LED) lamps. The manufacturers in the technical

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Figure 3. Simulation results for inlet flow rate of 10 LPM at 60 s: (a) steady-state velocity magnitude contour plot at the middle cross-section of serpentine flow channels; (b) electric potential contour plot on the conductive heating layer; (c) temperature contour plot on the solid surface; (d) temperature contour plot on the fluid surface.

Model Characterization of High-Voltage Layer Heater for Electric Vehicles through Electro-Thermo-Fluidic Simulations

This introduction paper is based on the paper “Model Characterization of High-Voltage Layer Heater for Electric Vehicles through Electro-Thermo-Fluidic Simulations” published by “Energies (MDPI)”. 1. Overview: 2. Abstract: This paper focuses on the modeling and analysis of a high-voltage layer heater (HVLH) designed for environmentally friendly vehicles, including electric vehicles (EVs) and plug-in hybrid electric

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Figure 1: Diagram of changing the cooling module material.

A New Hybrid Approach to Cooling High-Power Electronics with HPDC

This technical brief is based on the academic paper “Optimizing the Structural Design of Computing Units in Autonomous Driving Systems and Electric Vehicles to Enhance Overall Performance Stability” by Zhong, Yao-Nian, published in International Journal of Advance in Applied Science Research (2024). It is summarized and analyzed for HPDC professionals by the experts at CASTMAN.

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Figure 4. Active liquid cooling configuration—the liquid loop connects all the LB cold plates in series followed by the HB in series and then into the heat exchanger.

LIQUID COOLING OF BRIGHT LEDS FOR AUTOMOTIVE APPLICATIONS

This introduction paper is based on the paper “LIQUID COOLING OF BRIGHT LEDS FOR AUTOMOTIVE APPLICATIONS” published by “Not explicitly stated in the provided excerpt (likely EuroSimE Conference Proceedings, based on similar references)”. 1. Overview: 2. Abstract: With the advances in the technology of materials based on GaN, high brightness white light emitting diodes (LEDs)

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Fig. 3 The LED headlamp cooling system

The Summarize of High Power LED Headlamps Cooling Design ofAutomobile

This introduction paper is based on the paper “The Summarize of High Power LED Headlamps Cooling Design of Automobile” published by “Applied Mechanics and Materials”. 1. Overview: 2. Abstract: With the luminous flux of high-power white LED has been further improved, LED will gradually replace incandescent lamp and halogen lamp, and become the “fourth generation

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