This introduction paper is based on the paper “Challenges in Cooling Design of CPU Packages for High-Performance Servers” published by “Heat Transfer Engineering”. 1. Overview: 2. Abstract: Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed
This introductory paper is the research content of the paper “Medium temperature heat pipes – Applications, challenges and future direction” published by [Applied Thermal Engineering]. 1. Overview: 2. Abstract Heat pipes have been used for thermal management, especially in aerospace, electronics, automotive, and power generation. The operating temperature range requires specific fluid and casing materials.
This introductory paper is the research content of the paper [“‘PROMISING CASTING ALUMINUM ALLOYS WITHOUT REQUIREMENT FOR HEAT TREATMENT'”] published by [‘METAL 2019 Conference Proceedings’]. 1. Overview: 2. Abstract Three kinds of aluminum alloys based on Al-Zn-Mg system and doped with Ca, Ni and Ce were studied. Determination of hot tearing tendency, phase composition and
This article introduces the paper “An Overview of Heat Sink Technology” presented at the IJME 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright: This material was summarized based on the above paper, and
This introductory paper is the research content of the paper “Characterization of Mixed Metals Swaged Heat Sinks for Concentrated Heat Source” published by InterPACK’03®. 1. Overview: 2. Abstracts / Introduction AbstractExperimental study investigating thermal performance of four heatsink combinations: all Aluminum, all Copper, Copper baseplate/Aluminum fin, and Aluminum baseplate/Copper fin. Tests in a vertical wind
This introductory paper is the research content of the paper [“ECO-DESIGN OF HEAT SINKS BASED ON CAD/CAE TECHNIQUES”] published by [Proceedings in Manufacturing Systems]. 1. Overview: 2. Abstracts / Introduction In the era of Industry 4.0, the performance of manufacturing systems is intrinsically linked to the efficacy of embedded electronics. These components are crucial for
This article introduces the paper [‘Design of an LED Thermal System for Automotive Systems’] published by [‘2009 3rd International Conference on Power Electronics Systems and Applications’]. 1. Overview: 2. Abstracts or Introduction This paper investigates high power Light Emitted Diodes (LEDs) with a focus on heat distribution within the heat sink and the correlation between
This article introduces the paper [‘Cooling of Power Switching Device’] published by [‘Jurusan Teknik Elektro, Fakultas Teknik, Universitas Diponegoro’]. 1. Overview: 2. Abstracts or Introduction Abstrak: Dalam hal penggunaan mesin listrik, tentunya kebutuhan akan komponen elektronika daya sangatlah esensial. Komponen elektronika daya bertindak sebagai switching device yang berfungsi dalam pengaturan kinerja mesin listrik yang digunakan.
This article introduces the paper[‘Characterization of Mixed Metals Swaged Heat Sinks for Concentrated Heat Source’] published by [‘Proceedings of InterPACK’03®’]. 1. Overview: 2. Abstracts or Introduction This research paper presents an experimental investigation into the thermal performance of four distinct heatsink configurations under forced convection conditions. The study compares heatsinks constructed from Aluminum and Copper
This article introduces the paper ‘A Review of Heat Pipes: its Types and Applications’ published by ‘International Journal of Engineering Research & Technology (IJERT)’. 1. Overview: 2. Abstracts or Introduction Heat pipes are recognized as exceptional heat transfer devices, often termed “superconductors of heat” due to their superior heat transfer and extraction capabilities. The performance