Category Archives: heat sink-E

Figure 5. Six LED Arrayconfiguration and temperature profile.

Thermal study on novel spokes fin for high power LED

This paper summary is based on the article Thermal study on novel spokes fin for high power LED presented at the Engineering Research Express 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright: This

Read More

Fig. 1. Structure and dimension of (a) microchannel heat sink and (b) micro-pin-fin heat sink

Comparison of Micro-Pin-Fin and Microchannel Heat Sinks Considering Thermal-Hydraulic Performance and Manufacturability

This paper summary is based on the article Comparison of Micro-Pin-Fin and Microchannel Heat Sinks Considering Thermal-Hydraulic Performance and Manufacturability presented at the IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGY 1. Overview: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 2. Research Background: 6. Conclusion and Discussion: 7. Future Follow-up

Read More

Fig.1. Illustrations of heat sink samples according to the manufacturing method.

AN OVERVIEW OF HEAT SINK TECHNOLOGY

This paper summary is based on the article “An Overview of Heat Sink Technology” presented at the IJME 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright: This material was summarized based on the

Read More

Figure 3 A 3D schematic of the computational domain

An Experimental and Computational Study on the Thermal Performance of Phase Change

This paper summary is based on the article An Experimental and Computational Study on the Thermal Performance of Phase Change Material Heatsink Assemblies presented at the ASME and Applied Thermal Engineering 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future

Read More

Advanced Thermal Management for High-Power ICs-Optimizing Heatsink and Airflow Design

Advanced Thermal Management for High-Power ICs: Optimizing Heatsink and Airflow Design

This paper summary is based on the article Advanced Thermal Management for High-Power ICs: Optimizing Heatsink and Airflow Design presented at the Applied Sciences (MDPI) 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright:

Read More

Fig. 4. Rounded corners and reinforcement ribs on the lower part (left) and the upper part (right).

RESEARCH ON THE DESIGN FOR PROTECTING THE ARDUINO-MEGA MICROCONTROLLER USED AT AQUATIC EXPLORATION

This paper summary is based on the article RESEARCH ON THE DESIGN FOR PROTECTING THE ARDUINO-MEGA MICROCONTROLLER USED AT AQUATIC EXPLORATION presented at the ACTA TECHNICA NAPOCENSIS 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References:

Read More

Fig. 6. Micro-morphologies of die cast AZ91D specimens after immersion in 5 wt

Effect of Aging on Yield Stress and Corrosion Resistance of Die Cast Magnesium Alloy

This page summarizes the research paper “Effect of Aging on Yield Stress and Corrosion Resistance of Die Cast Magnesium Alloy”. This study investigates how aging at 160°C affects the corrosion behavior of die cast magnesium alloy AZ91D, linking these changes to alterations in the material’s microstructure and composition. 1. Overview: 2. Research Background: 3. Research

Read More

Figure 8. Schematic diagram of cooling system in LED headlamp.

Application Specific LED Packaging for Automotive Forward-lighting Application and Design of Whole Lamp Module

1. Overview: 2. Research Background: The automotive industry is increasingly adopting LEDs for headlights, driven by advantages such as reliability, energy efficiency, compactness, durability, environmental friendliness, and longevity [1]. However, conventional LED packaging differs significantly from halogen or HID lamps in optical and thermal characteristics, posing challenges for direct application in forward-lighting. A study highlights

Read More

Fig. 1. HPDC process overview.

Analytical Cost Estimation Model in High Pressure Die Casting

This document provides a detailed summary of the research paper “Analytical cost estimation model in High Pressure Die Casting” published in Procedia Manufacturing in 2017. 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology: 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright:

Read More

Figure 5 Reflector models

OPTIMAL PLATE-FIN DESIGN FOR IMPROVING HEAT DISSIPATION PERFORMANCE OF AUTOMOBILE LAMP REFLECTORS

1. Overview: 2. Research Background: Automobile headlamp reflectors experience high temperatures due to heat generated by the lamp and their sealed structure. These high temperatures reduce light output and shorten lamp lifespan, potentially causing thermal shock deformation in nearby components. While previous research has investigated various aspects of LED lamp design and heat dissipation, including

Read More