This introduction paper is based on the paper “Challenges in Cooling Design of CPU Packages for High-Performance Servers” published by “Heat Transfer Engineering”. 1. Overview: 2. Abstract: Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed
This introductory paper is the research content of the paper “Thermal challenges of Wide Band Gap power electronics component in electrical vehicle” published by ResearchGate. 1. Overview: 2. Abstract The cooling of power electronics is a fundamental for the best compromise between efficiency, compactness and cost. For the next generation of High Voltage boxes we
This article introduces the paper [‘Cooling of Power Switching Device’] published by [‘Jurusan Teknik Elektro, Fakultas Teknik, Universitas Diponegoro’]. 1. Overview: 2. Abstracts or Introduction Abstrak: Dalam hal penggunaan mesin listrik, tentunya kebutuhan akan komponen elektronika daya sangatlah esensial. Komponen elektronika daya bertindak sebagai switching device yang berfungsi dalam pengaturan kinerja mesin listrik yang digunakan.
This article introduces the paper “Multi-Objective Optimization of Plate-Fin Heat Exchangers via Non-Dominated Sequencing”. 1. Overview: 2. Research Background: Plate-fin heat exchangers are widely used for heat dissipation in automotive engines due to their compact and lightweight structure, excellent heat transfer performance, and low production cost. Serrated staggered fins are commonly employed to enhance the
