Tag Archives: cold plate

Figure 7. Cross Section Temperature Profiles in Natural Convection for assembly in Figure 2. (a) Top view and (b) Side view. Temperature range shown is 60 to 100°C.

Thermal Management of Bright LEDs for Automotive Applications

This introduction paper is based on the paper “Thermal Management of Bright LEDs for Automotive Applications” published by “7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006”. 1. Overview: 2. Abstract: High brightness white light emitting diodes (LEDs) have shown to be very promising for many illumination

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Figure 1 A typical structure of CPU package and heat sink module.

Challenges in Cooling Design of CPU Packages for High-Performance Servers

This introduction paper is based on the paper “Challenges in Cooling Design of CPU Packages for High-Performance Servers” published by “Heat Transfer Engineering”. 1. Overview: 2. Abstract: Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed

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Figure 9: Top: air-cooled example. Bottom: liquidcooled example.

Thermal Challenges of Wide Band Gap Power Electronics Component in Electrical Vehicle

This introductory paper is the research content of the paper “Thermal challenges of Wide Band Gap power electronics component in electrical vehicle” published by ResearchGate. 1. Overview: 2. Abstract The cooling of power electronics is a fundamental for the best compromise between efficiency, compactness and cost. For the next generation of High Voltage boxes we

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Cooling of Power Switching Device

Cooling of Power Switching Device

This article introduces the paper [‘Cooling of Power Switching Device’] published by [‘Jurusan Teknik Elektro, Fakultas Teknik, Universitas Diponegoro’]. 1. Overview: 2. Abstracts or Introduction Abstrak: Dalam hal penggunaan mesin listrik, tentunya kebutuhan akan komponen elektronika daya sangatlah esensial. Komponen elektronika daya bertindak sebagai switching device yang berfungsi dalam pengaturan kinerja mesin listrik yang digunakan.

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Figure 1. The heat exchangers are modeled from bottom to top as layers 1 to 14, where the odd-numbered layers are water-side fins and the even-numbered layers are oil-side fins: (a) Heat exchangers model, (b) Simplified model of heat exchangers.

Multi-Objective Optimization of Plate-Fin Heat Exchangers via Non-Dominated Sequencing

This article introduces the paper “Multi-Objective Optimization of Plate-Fin Heat Exchangers via Non-Dominated Sequencing”. 1. Overview: 2. Research Background: Plate-fin heat exchangers are widely used for heat dissipation in automotive engines due to their compact and lightweight structure, excellent heat transfer performance, and low production cost. Serrated staggered fins are commonly employed to enhance the

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