This paper summary is based on the article An Experimental and Computational Study on the Thermal Performance of Phase Change Material Heatsink Assemblies presented at the ASME and Applied Thermal Engineering 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future
This paper summary is based on the article Advanced Thermal Management for High-Power ICs: Optimizing Heatsink and Airflow Design presented at the Applied Sciences (MDPI) 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright:
Abstract Jie WeiCorporate Product Technology Unit, Fujitsu Limited , Kawasaki , Japan Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed from a viewpoint of industrial application. Particular attention is directed to heat conduction in the
