Tag Archives: heat spreader

Figure 1 A typical structure of CPU package and heat sink module.

Challenges in Cooling Design of CPU Packages for High-Performance Servers

This introduction paper is based on the paper “Challenges in Cooling Design of CPU Packages for High-Performance Servers” published by “Heat Transfer Engineering”. 1. Overview: 2. Abstract: Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed

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Figure 9: Top: air-cooled example. Bottom: liquidcooled example.

Thermal Challenges of Wide Band Gap Power Electronics Component in Electrical Vehicle

This introductory paper is the research content of the paper “Thermal challenges of Wide Band Gap power electronics component in electrical vehicle” published by ResearchGate. 1. Overview: 2. Abstract The cooling of power electronics is a fundamental for the best compromise between efficiency, compactness and cost. For the next generation of High Voltage boxes we

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Fig. 1 Types of heat pipes

A review of heat pipe application including new opportunities

This article introduces the paper ‘A review of heat pipe application including new opportunities’ published by ‘Frontiers in Heat Pipes’. 1. Overview: 2. Abstracts or Introduction This paper provides a detailed review of heat pipe applications, spanning from computer electronics to renewable energy systems. In the realm of computer electronics, the escalating performance and power

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Figure 3 A 3D schematic of the computational domain

An Experimental and Computational Study on the Thermal Performance of Phase Change

This article introduces the paper “An Experimental and Computational Study on the Thermal Performance of Phase Change Material Heatsink Assemblies” presented at the ASME and Applied Thermal Engineering 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8.

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Advanced Thermal Management for High-Power ICs-Optimizing Heatsink and Airflow Design

Advanced Thermal Management for High-Power ICs: Optimizing Heatsink and Airflow Design

This article introduces the paper “Advanced Thermal Management for High-Power ICs: Optimizing Heatsink and Airflow Design” presented at the Applied Sciences (MDPI) 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright: This material was

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