In the race for next-generation technology, heat isn’t just a byproduct; it’s the primary bottleneck. CASTMAN’s High-Performance Thermal Alloys are the definitive solution to conquer this challenge, ensuring your products achieve unparalleled performance and reliability. In an era of unprecedented power density—from electric vehicles and AI servers to 5G infrastructure and high-output LEDs—effective Thermal Management is no
This introduction paper is based on the paper “Challenges in Cooling Design of CPU Packages for High-Performance Servers” published by “Heat Transfer Engineering”. 1. Overview: 2. Abstract: Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed
This introductory paper is the research content of the paper “Thermal challenges of Wide Band Gap power electronics component in electrical vehicle” published by ResearchGate. 1. Overview: 2. Abstract The cooling of power electronics is a fundamental for the best compromise between efficiency, compactness and cost. For the next generation of High Voltage boxes we
This article introduces the paper ‘A review of heat pipe application including new opportunities’ published by ‘Frontiers in Heat Pipes’. 1. Overview: 2. Abstracts or Introduction This paper provides a detailed review of heat pipe applications, spanning from computer electronics to renewable energy systems. In the realm of computer electronics, the escalating performance and power
This article introduces the paper “An Experimental and Computational Study on the Thermal Performance of Phase Change Material Heatsink Assemblies” presented at the ASME and Applied Thermal Engineering 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8.
This article introduces the paper “Advanced Thermal Management for High-Power ICs: Optimizing Heatsink and Airflow Design” presented at the Applied Sciences (MDPI) 1. Overview: 2. Research Background: 3. Research Purpose and Research Questions: 4. Research Methodology 5. Main Research Results: 6. Conclusion and Discussion: 7. Future Follow-up Research: 8. References: 9. Copyright: This material was
