Research Progress on Thermal Conductivity of High-Pressure Die-Cast Aluminum Alloys

This paper summary is based on the article Research Progress on Thermal Conductivity of High-Pressure Die-Cast Aluminum Alloys presented at the Metals, MDPI

1. Overview:

  • Title: Research Progress on Thermal Conductivity of High-Pressure Die-Cast Aluminum Alloys
  • Author: Yixian Liu and Shoumei Xiong
  • Publication Year: 2024
  • Publishing Journal/Academic Society: Metals, MDPI
  • Keywords: high-pressure die casting; aluminum alloy; thermal conductivity; alloy development
Figure 1. Density and thermal conductivity of several pure metals, adapted from [9-11].
Figure 1. Density and thermal conductivity of several pure metals, adapted from [9-11].

2. Research Background:

  • Social/Academic Context of the Research Topic: High-pressure die casting (HPDC) is widely used for manufacturing aluminum alloy heat dissipation components in vehicles, electronics, and communication industries. The increasing demand for lightweight and environmentally friendly materials, particularly in the automotive industry to reduce CO2 emissions, has broadened the application of aluminum alloys. Aluminum's excellent thermal conductivity compared to other metals makes it crucial for thermal management, especially in heat dissipation components. The rising power density of electronic devices and increasing battery capacity in electric vehicles further intensifies the need for high-thermal-conductivity aluminum alloys in heat dissipation applications.
  • Limitations of Existing Research: While extensive research exists on aluminum alloys, a systematic review specifically focusing on the thermal conductivity of HPDC aluminum alloys is absent. Commercial die-cast aluminum alloys exhibit relatively low thermal conductivity due to rapid cooling rates and unique solidification microstructures inherent in the HPDC process. These microstructures often contain higher solute concentrations, smaller grain sizes, and increased porosity compared to gravity castings, impacting thermal conductivity. Furthermore, alloys with high thermal conductivity often demonstrate low yield strength, indicating a property trade-off.
  • Necessity of the Research: The development of non-heat-treatable HPDC aluminum alloys with high thermal conductivity is critical to meet the growing demands for efficient heat dissipation in various industries, especially for advanced applications like Giga-Casting in electric vehicles. A comprehensive review is needed to guide the development of new high-thermal-conductivity die-cast aluminum alloys by summarizing the current research status, including the effects of alloy composition, processing parameters, and heat treatment strategies.

3. Research Purpose and Research Questions:

  • Research Purpose: This review aims to provide a comprehensive overview of the research progress on the thermal conductivity of high-pressure die-cast aluminum alloys. It intends to guide the development of new high-thermal-conductivity die-cast aluminum alloys by summarizing key findings and research directions.
  • Key Research Questions:
    • What are the fundamental mechanisms of heat transport in aluminum alloys, and how do they relate to thermal conductivity?
    • What are the common die-cast aluminum alloy systems used for heat dissipation components, and how are their compositions optimized for thermal conductivity?
    • How do HPDC processing parameters affect the thermal conductivity of die-cast aluminum alloys?
    • What heat treatment strategies can enhance the thermal conductivity of die-cast aluminum alloys?
    • What theoretical models are used to calculate and predict the thermal conductivity of die-cast aluminum alloys?
  • Research Hypotheses: This paper is a review and does not explicitly state research hypotheses. However, implicitly, the review is based on the understanding that:
    • Thermal conductivity of HPDC aluminum alloys can be improved by optimizing alloy composition, processing parameters, and heat treatment.
    • Theoretical models can aid in understanding and predicting thermal conductivity in these alloys.

4. Research Methodology

  • Research Design: This study is a comprehensive literature review.
  • Data Collection Method: The authors collected data by reviewing a wide range of published research articles, journals, and patents related to the thermal conductivity of high-pressure die-cast aluminum alloys.
  • Analysis Method: The authors performed a qualitative analysis of the collected literature, summarizing and synthesizing the findings into a structured review. They categorized the research progress based on key aspects such as heat transport mechanisms, alloy systems, processing parameters, heat treatment, and theoretical models.
  • Research Subjects and Scope: The review focuses on the research progress related to the thermal conductivity of high-pressure die-cast aluminum alloys. The scope includes:
    • Heat transport mechanisms in aluminum alloys.
    • Common die-cast aluminum alloy systems (Al-Si and silicon-free).
    • Effects of HPDC processing parameters on thermal conductivity.
    • Heat treatment strategies for enhancing thermal conductivity.
    • Theoretical models for calculating thermal conductivity.

5. Main Research Results:

  • Key Research Results:
    • Heat Transport Mechanism: Heat conduction in aluminum alloys is primarily through electron transport and phonon transport, with electron transport being dominant. Thermal conductivity is influenced by electron scattering mechanisms, including electron-electron, electron-phonon, and electron-impurity scattering. Electron-impurity scattering is particularly significant in alloys.
    • Alloy Systems:
      • Al-Si Alloys: These are common for heat dissipation components but have limited thermal conductivity due to eutectic silicon and alloying elements. Strategies to improve thermal conductivity include reducing Si content, modifying eutectic particles (e.g., using Sr), and reducing trace elements in solid solutions (e.g., boron treatment).
      • Silicon-Free Alloys (Al-Ni, Al-Fe, Al-Fe-Ni): These systems offer higher thermal conductivity potential due to lower eutectic points and reduced detrimental effects of alloying elements compared to Al-Si alloys. Al-Fe and Al-Fe-Ni alloys show promise for achieving very high thermal conductivity.
    • Processing Parameters: HPDC processing parameters like shot speed, intensification pressure, and vacuum significantly affect porosity, microstructure, and consequently, thermal conductivity. Increased porosity generally reduces thermal conductivity. Rheological die-casting (ACSR Rheo-HPDC) can improve thermal conductivity by refining microstructure and reducing solute concentration.
    • Heat Treatment: Heat treatment, particularly T7, can enhance thermal conductivity by spheroidizing eutectic silicon and precipitating solutes from solid solutions. Direct aging treatment is also explored as a potentially efficient method for die castings.
    • Theoretical Models: Various theoretical models, including Matthiessen's rule and composite models (Series, Parallel, Maxwell-Eucken, Effective Medium), are used to predict and understand thermal conductivity in aluminum alloys. However, a model specifically tailored for the complex microstructure of die-cast alloys is needed.
  • Statistical/Qualitative Analysis Results: The paper primarily presents a qualitative synthesis of research findings. Quantitative data and results are quoted directly from the referenced papers and summarized in the review. For example, Table 1 shows thermal conductivity and yield strength of commercial die-cast aluminum alloys, and Table 2 shows the effect of alloying elements on electrical resistivity.
  • Data Interpretation: The review interprets the data from various studies to identify trends and draw conclusions about the factors influencing thermal conductivity in HPDC aluminum alloys. It highlights the trade-offs between strength and thermal conductivity, the benefits and limitations of different alloy systems and processing techniques, and the potential of heat treatment and theoretical modeling.
  • Figure Name List:
    • Figure 1. Density and thermal conductivity of several pure metals, adapted from [9-11].
    • Figure 2. The process of HPDC: (a) pouring the melt; (b) slow-shot filling; (c) melt at the gate; (d) fast-shot filling; (e) pressure intensification; (f) opening the mold (reprinted with permission from ref. [16], Xiaobo Li, Tsinghua Univeristy, 2017).
    • Figure 3. Applications of HPDC heat dissipation components.
    • Figure 4. The solidification rate of die casting (reprinted with permission from ref. [22], 2022, Elsevier).
    • Figure 5. Electron scattering patterns in an aluminum alloy.
    • Figure 6. The effect of alloying elements on (a) electrical conductivity (reprinted with permission from ref. [62], 2006, Elsevier) and thermal conductivity using (b) theoretical method (reprinted with permission from ref. [58], 2023, Springer) and (c) experimental method of aluminum alloys (reprinted with permission from ref. [64], 2015, Springer).
    • Figure 7. Problems of traditional Al-Si die-cast alloys.
    • Figure 8. Microstructure and properties of different Al-Si die-cast alloys with low Si contents: (a) Al-8Si (reprinted with permission from ref. [74], 2018, Elsevier), (b) Al–6Si with Cu and Zn (reprinted with permission from ref. [75], 2016, Springer), (c) Al–(6~8)Si with Cu or Mg (reprinted with permission from ref. [80], 2022, Elsevier).
    • Figure 9. The ternary eutectic point of the Al-Si-Ni system (reprinted with permission from ref. [84], 2015, Springer).
    • Figure 10. (a) Effect of Mn on thermal conductivity of the die-cast Al-Si alloy (reprinted with permission from ref. [61], 2013, Springer). (b) The purification process of boron treatment (reprinted with permission from ref. [91], 2018, Elsevier) and (c) the effect of boron on the thermal conductivity of ADC12 alloy (reprinted ref. [95]).
    • Figure 11. (a,b) Mechanism of improving thermal conductivity by modifying the eutectic Si (reprinted with permission from ref. [24], 2020, Springer).
    • Figure 12. (a) Variation in thermal conductivity under different fractions of porosity caused by processing parameters (reprinted with permission from ref. [123], 2017, Elsevier). (b) Thermal conductivity and corresponding (c) porosity distribution under different vacuum levels (reprinted with permission from ref. [124], 2020, Elsevier). (d) Distribution of ESCs and (e) thermal conductivity of die-cast alloys under different shot sleeves (reprinted with permission from ref. [125], 2022, Elsevier).
    • Figure 13. The schematic diagrams of the ACSR Rheo-HPDC process (reprinted with permission from ref. [36], 2022, Elsevier).
Figure 2. The process of HPDC: (a) pouring the melt; (b) slow-shot filling; (c) melt at the gate; (d) fast-shot filling; (e) pressure intensification; (f) opening the mold (reprinted with permission from ref. [16], Xiaobo Li, Tsinghua Univeristy, 2017).
Figure 2. The process of HPDC: (a) pouring the melt; (b) slow-shot filling; (c) melt at the gate; (d) fast-shot filling; (e) pressure intensification; (f) opening the mold (reprinted with permission from ref. [16], Xiaobo Li, Tsinghua Univeristy, 2017).
Figure 4. The solidification rate of die casting (reprinted with permission from ref. [22], 2022, Elsevier).
Figure 4. The solidification rate of die casting (reprinted with permission from ref. [22], 2022, Elsevier).
Figure 5. Electron scattering patterns in an aluminum alloy
Figure 5. Electron scattering patterns in an aluminum alloy
Figure 8. Microstructure and properties of different Al-Si die-cast alloys with low Si contents: (a) Al-8Si (reprinted with permission from ref. [74], 2018, Elsevier), (b) Al–6Si with Cu and Zn (reprinted with permission from ref. [75], 2016, Springer), (c) Al–(6~8)Si with Cu or Mg (reprinted with permission from ref. [80], 2022, Elsevier).
Figure 8. Microstructure and properties of different Al-Si die-cast alloys with low Si contents: (a) Al-8Si (reprinted with permission from ref. [74], 2018, Elsevier), (b) Al–6Si with Cu and Zn (reprinted with permission from ref. [75], 2016, Springer), (c) Al–(6~8)Si with Cu or Mg (reprinted with permission from ref. [80], 2022, Elsevier).
Figure 10. (a) Effect of Mn on thermal conductivity of the die-cast Al-Si alloy (reprinted with permission from ref. [61], 2013, Springer). (b) The purification process of boron treatment (reprinted with permission from ref. [91], 2018, Elsevier) and (c) the effect of boron on the thermal conductivity of ADC12 alloy (reprinted ref. [95]).
Figure 10. (a) Effect of Mn on thermal conductivity of the die-cast Al-Si alloy (reprinted with permission from ref. [61], 2013, Springer). (b) The purification process of boron treatment (reprinted with permission from ref. [91], 2018, Elsevier) and (c) the effect of boron on the thermal conductivity of ADC12 alloy (reprinted ref. [95]).
Figure 13. The schematic diagrams of the ACSR Rheo-HPDC process (reprinted with permission from ref. [36], 2022, Elsevier).
Figure 13. The schematic diagrams of the ACSR Rheo-HPDC process (reprinted with permission from ref. [36], 2022, Elsevier).

6. Conclusion and Discussion:

  • Summary of Main Results: The review concludes that while significant progress has been made in developing high-thermal-conductivity die-cast aluminum alloys, challenges remain. Al-Si alloys are still dominant but require modifications to enhance thermal conductivity. Silicon-free alloys like Al-Ni and Al-Fe show great potential but need further research, especially under die-casting conditions, to optimize microstructure and mechanical properties alongside thermal conductivity. Processing parameters and heat treatments are crucial tools for tailoring alloy properties. Theoretical models are evolving but need to be refined for die-cast alloys' complex microstructures.
  • Academic Significance of the Research: This review provides a valuable resource for researchers and engineers in the field of die casting and aluminum alloys. It systematically summarizes the current state of knowledge, identifies research gaps, and highlights promising directions for future research. It emphasizes the need for deeper understanding of phonon thermal conductivity in alloys and the microstructure-thermal conductivity relationship in die-cast conditions.
  • Practical Implications: The findings have significant practical implications for the die casting industry. The review guides the development of new aluminum alloys with enhanced thermal conductivity for heat dissipation applications. It underscores the importance of optimizing alloy composition, processing parameters (including vacuum and rheological die-casting), and heat treatment strategies to achieve high-performance die-cast components. The insights into silicon-free alloys offer pathways for developing next-generation high-conductivity materials.
  • Limitations of the Research: The review primarily focuses on published literature. The authors acknowledge that the understanding of the effect of processing parameters on microstructure and thermal conductivity is still incomplete. Furthermore, the review notes that research on die-cast alloys is less extensive compared to gravity-cast alloys, indicating a need for more focused studies on die-cast materials. The complexity of microstructure formation during die casting and the lack of a comprehensive theoretical model for die-cast alloys are also limitations.

7. Future Follow-up Research:

  • Directions for Follow-up Research:
    • Further in-depth studies on the relationship between phonon thermal conductivity and alloy compositions in aluminum alloys.
    • More research on silicon-free HPDC aluminum alloys (Al-Ni, Al-Fe, Al-Fe-Ni) under die-casting conditions, focusing on microstructure control and mechanical property optimization.
    • Systematical investigations into the definite influence relationships between HPDC processing parameters and thermal conductivity, including solute content, eutectic modification, and porosity.
    • Exploration of direct aging treatment for die-cast alloys to improve comprehensive properties efficiently.
    • Development of a new thermal conductivity calculation model specifically designed for the complex microstructures of die-cast alloys.
  • Areas Requiring Further Exploration:
    • Optimizing processing parameters for die-cast alloys with high thermal conductivity using advanced simulation software.
    • Improving the mechanical properties (strength, castability) of high-thermal-conductivity die-cast aluminum alloys to meet industrial application requirements.
    • Investigating the long-term performance and reliability of new high-thermal-conductivity die-cast aluminum alloys in real-world applications.

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9. Copyright:

This material is Yixian Liu and Shoumei Xiong's paper: Based on Research Progress on Thermal Conductivity of High-Pressure Die-Cast Aluminum Alloys.
Paper Source: https://doi.org/10.3390/met14040370

This material was summarized based on the above paper, and unauthorized use for commercial purposes is prohibited.
Copyright © 2025 CASTMAN. All rights reserved.

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