Tag Archives: super computer

Figure 1 A typical structure of CPU package and heat sink module.

Challenges in Cooling Design of CPU Packages for High-Performance Servers

By Aluminium-E, Technical Data-E, , , , , ,

Abstract Jie WeiCorporate Product Technology Unit, Fujitsu Limited , Kawasaki , Japan Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed from a viewpoint of industrial application. Particular attention is directed to heat conduction in the

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Cu products developments

Started mass production of COOLING PLATE applying copper die casting method | 동 다이캐스팅 공법 적용 COOLING PLATE 양산 착수

By Copper-E, News & Notify-E, Technical Data-E, , ,

Started mass production of COOLING PLATE applying copper die casting method Started mass production of cooling plate using copper die casting method Built-in mass production system by applying copper die casting method for cooling plate for super computer Signed a contract with Japanese company Kaga electron with FUJIKURA. Mass production began in March 2019. Super

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