This introduction paper is based on the paper “Challenges in Cooling Design of CPU Packages for High-Performance Servers” published by “Heat Transfer Engineering”. 1. Overview: 2. Abstract: Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed
Started mass production of COOLING PLATE applying copper die casting method Started mass production of cooling plate using copper die casting method Built-in mass production system by applying copper die casting method for cooling plate for super computer Signed a contract with Japanese company Kaga electron with FUJIKURA. Mass production began in March 2019. Super
