Effect of Mold Temperature and Pouring Temperature on the Crack Behavior of Composite Water-Soluble Salt Cores

Jingkai Zhang1, Yang Li1, Lai Song1, Weihua Liu1 & Xue Zou1

Abstract

This study analyzes the effects of different pouring temperatures and mold temperatures on the crack behavior of NaCl–Na2SO4 composite water-soluble salt cores (WSSC). Firstly, calculate the solid fraction during the solidification process of the salt core using the Newton baseline method. Then predict the sensitivity of the salt core to thermal cracking using the cracking susceptibility coefficient model. Subsequently, the effects of different pouring temperatures and mold temperatures on the solidification and crack behavior of salt cores were compared. The results showed that when the pouring temperature was 800 °C and the mold temperature was 200 °C, the number of cracks significantly decreased, and the surface quality was the best. Finally, the microstructure and phase composition of WSSC were characterized using scanning electron microscopy. The results of this study indicate that increasing the mold temperature and selecting an appropriate pouring temperature can help improve the density of the salt core structure, reduce susceptibility of cracking, and enhance the surface quality of the salt core.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Shenyang University of Technology, Shenyang, 110870, Liaoning, ChinaJingkai Zhang, Yang Li, Lai Song, Weihua Liu & Xue Zou

Authors

  1. Jingkai ZhangView author publicationsYou can also search for this author inPubMedGoogle Scholar
  2. Yang LiView author publicationsYou can also search for this author inPubMedGoogle Scholar
  3. Lai SongView author publicationsYou can also search for this author inPubMedGoogle Scholar
  4. Weihua LiuView author publicationsYou can also search for this author inPubMedGoogle Scholar
  5. Xue ZouView author publicationsYou can also search for this author inPubMedGoogle Scholar

Corresponding authors

Correspondence to Lai Song or Weihua Liu.

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