Figure 2. Schematic illustration of the mechanism of die soldering, indicating (a) the presence of liquid at the die surface when the temperature at the surface is higher than a critical temperature, 655C, and (b) the formation of a joint between the casting and the die on solidification of this liquid phase.

Published at 800 × 460 in Mechanism of Die Soldering During Aluminum Die Casting

Figure 2. Schematic illustration of the mechanism of die soldering, indicating (a) the presence of liquid at the die surface when the temperature at the surface is higher than a critical temperature, 655C, and (b) the formation of a joint between the casting and the die on solidification of this liquid phase.

Figure 2. Schematic illustration of the mechanism of die soldering, indicating (a) the presence of liquid at the die surface when the temperature at the surface is higher than a critical temperature, 655C, and (b) the formation of a joint between the casting and the die on solidification of this liquid phase.

Figure 2. Schematic illustration of the mechanism of die soldering, indicating (a) the presence of liquid at the die surface when the temperature at the surface is higher than a critical temperature, 655C, and (b) the formation of a joint between the casting and the die on solidification of this liquid phase.