Figure 3. Typical microstructures observed at the die surface for three cases: (a) metallurgical bond resulting in soldering, and (b) absence of reaction between steel and aluminum.

Published 03/27/2025 at 1095 × 494 in Mechanism of Die Soldering During Aluminum Die Casting

Figure 3. Typical microstructures observed at the die surface for three cases: (a) metallurgical bond resulting in soldering, and (b) absence of reaction between steel and aluminum.

Figure 3. Typical microstructures observed at the die surface for three cases: (a) metallurgical bond resulting in soldering, and (b) absence of reaction between steel and aluminum.

Figure 3. Typical microstructures observed at the die surface for three cases: (a) metallurgical bond resulting in soldering, and (b) absence of reaction between steel and aluminum.