Fig. 4. Pictorial views of simple, circular pin-fin and copper foam-based heat sinks.

Published 02/07/2024 at 881 × 293 in Experimental investigation for thermal performance enhancement of various heat sinks using Al2O3 NePCM for cooling of electronic devices

Fig. 4. Pictorial views of simple, circular pin-fin and copper foam-based heat sinks.

Fig. 4. Pictorial views of simple, circular pin-fin and copper foam-based heat sinks.

Fig. 4. Pictorial views of simple, circular pin-fin and copper foam-based heat sinks.