Fig. 6. Heat sink: a) upper part’s contact area pressing against the microprocessor, b) shape of the fins.

Published 02/19/2025 at 677 × 307 in RESEARCH ON THE DESIGN FOR PROTECTING THE ARDUINO-MEGA MICROCONTROLLER USED AT AQUATIC EXPLORATION

Fig. 6. Heat sink: a) upper part’s contact area pressing against the microprocessor, b) shape of the fins.

Fig. 6. Heat sink: a) upper part’s contact area pressing against the microprocessor, b) shape of the fins.

Fig. 6. Heat sink: a) upper part’s contact area pressing against the microprocessor, b) shape of the fins.