List of Semiconductor Manufacturing Equipment Parts
This list provides potential components for semiconductor manufacturing equipment that could be, or are, produced using high-pressure aluminum die casting. The following list is based on general knowledge of die casting applications and semiconductor equipment design.
List of Semiconductor Manufacturing Equipment Parts Potentially Made via High-Pressure Aluminum Die Casting:
| Part Name | Description | Advantages of Die Casting |
|---|---|---|
| Heat Sinks | Dissipate heat generated by electronic components. | High thermal conductivity of aluminum, complex shapes possible, cost-effective for mass production |
| Chassis/Frames | Provide structural support for various components of the equipment. | High strength-to-weight ratio, good dimensional accuracy. |
| Vacuum Chambers (parts) | Components within vacuum chambers requiring precise dimensions and airtight seals | Good dimensional accuracy, potential for surface treatments to enhance vacuum sealing. |
| Fixture Components | Parts of clamping systems, jigging and tooling for wafer handling. | Good dimensional accuracy, repeatable production. |
| Pump Housings | Enclosures for vacuum pumps or other fluid handling systems. | Can be designed for easy assembly and maintenance. |
| Base Plates | Support structures for other components. | High stiffness, robust construction. |
Lightweighting and Rigidity: Semiconductor equipment often requires precise movements and stable structures. Al HPDC offers a good balance of lightweighting (reducing overall machine weight and inertia) and rigidity (maintaining structural integrity under stress), which is crucial for high-speed, high-precision operations. This is analogous to the benefits seen in automotive applications, where lightweighting improves fuel efficiency and handling.
Complex Geometries and Integration: Semiconductor manufacturing equipment often involves intricate designs with complex internal channels for cooling, gas flow, or vacuum systems. Al HPDC's ability to produce complex shapes in a single casting can reduce the number of parts, simplify assembly, and improve overall system performance. This is similar to the part consolidation advantages observed in other industries using die casting.
Thermal Management: Efficient heat dissipation is crucial in semiconductor equipment due to the heat generated by various processes. Aluminum's excellent thermal conductivity, combined with the design freedom offered by die casting, can enable optimized heat sink designs and integrated cooling channels within components.
Cost-Effectiveness for High-Volume Production: While semiconductor equipment is generally produced in lower volumes compared to automotive parts, certain standardized components or sub-assemblies might benefit from the cost efficiencies of HPDC, especially if volumes increase or designs become more standardized.
Corrosion Resistance: The controlled environments within semiconductor fabs minimize exposure to harsh conditions. However, aluminum's inherent corrosion resistance provides an added layer of durability and reliability for die-cast components.
Examples Parts of Aluminum High-Pressure Die Casting:
Chambers & Housings:
- Vacuum Chamber Housing
- CVD Chamber Side Wall
- ALD Chamber Base
- Plasma Chamber Lid
- Ion Implant Chamber Component
- Heat Treatment Chamber Housing
- Sputtering Chamber Body
- Etching Chamber Side Panel
- Deposition Chamber Support
- Cleanroom Equipment Housing
Robots & Handling Systems:
- Wafer Handling Robot Base
- Robot Arm Component
- Wafer Carrier Support
- Tool Changer Housing
- Handling System Body
- Wafer Loading/Unloading System Component
- Robot Gripper Component
- Conveyor System Frame
- Automation System Component
- Automated Material Handling System Frame
Pumps & Valves:
- Vacuum Pump Housing
- Gas Valve Body
- Coolant Pump Case
- Chemical Pump Component
- Exhaust System Component
- Flow Control Valve Housing
- Pressure Control Valve Body
- Solenoid Valve Case
- Vacuum Valve Component
- Pump Bearing Housing
Etc:
- Vacuum Chamber Parts
- Chamber 외벽
- Chamber lid
- View port housing
- Gate valve housing
- Vacuum manifold
- Isolation valve body
- Chamber liner parts
- Wafer Transfer System Parts
- Transfer arm housing
- Robot arm components
- Wafer handler frame
- Linear motion guide housing
- End effector body
- Buffer station frame
- Load port frame components
- Process Gas Delivery Parts
- Gas line manifold
- Mass flow controller housing
- Gas box frame
- Pressure regulator housing
- Gas distribution plate
- Flow control valve body
- Purge gas system housing
- Power Supply & Control Housing
- Power supply housing
- Control panel frame
- Electronic cabinet housing
- PCB mounting frame
- Connector housing
- Switch box housing
- Terminal block housing
- Cooling System Parts
- Cooling block
- Heat exchanger housing
- Coolant manifold
- Pump housing
- Flow meter housing
- Temperature control unit frame
- Cooling line connection block
- Stage & Motion System
- Stage base frame
- Linear motor housing
- Bearing housing
- Guide rail support
- Motion control housing
- Stage cooling plate
- Position sensor housing
- Optical Support Parts
- Lens holder frame
- Mirror mount housing
- Beam splitter housing
- Optical bench components
- Alignment mechanism housing
- Focus mechanism frame
- Optical sensor housing
- Etc
- Heat Exchanger Components
- Wiring Boxes
- Power Supply Cases
- Control System Housings
- Sensor Mounting Brackets
- Actuator Housings
- Motor Housings
- Gearbox Cases
- Bearing Housings
- Cooling System Components
- Gas Piping Connectors
- Vacuum Piping Connectors
- Electrical Wiring Connectors
- Safety Device Cases
- Vibration Damper Components
- Support Brackets
- Frames
- Covers
- Panels
- Cases