This introduction paper is based on the paper “Challenges in Cooling Design of CPU Packages for High-Performance Servers” published by “Heat Transfer Engineering”. 1. Overview: 2. Abstract: Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed
This introductory paper is the research content of the paper [“ECO-DESIGN OF HEAT SINKS BASED ON CAD/CAE TECHNIQUES”] published by [Proceedings in Manufacturing Systems]. 1. Overview: 2. Abstracts / Introduction In the era of Industry 4.0, the performance of manufacturing systems is intrinsically linked to the efficacy of embedded electronics. These components are crucial for
